CAUTION: The small device geometries inherent to the design of this bipolar component increase the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken
in handling and assembly of this component to prevent damage and/or degradation which may be induced by
ESD.
Small Outline, 5 Lead, Low
Input Current, High Gain
Optocouplers
Technical Data
HCPL-M700
HCPL-M701
Description
These small outline, low input
current, high gain optocouplers
are single channel devices in a
five lead miniature footprint.
They are electrically equivalent
to the following HP
optocouplers:
Features
• Surface Mountable
• Very Small, Low Profile
JEDEC Registered
Package Outline
• Compatible with Infrared
Vapor Phase Reflow and
Wave Soldering Processes
• High Current Transfer
Ratio - 2000%
• Low Input Current
Capability - 0.5 mA
• TTL Compatible Output -
VOL = 0.1 V
• Guaranteed ac and dc
Performance Over
Temperature: 0
°C to 70°C
• High Output Current -
60 mA
• Recognized under the
Component Program of
U.L. (File No. E55361) for
Dielectric Withstand Proof
Test Voltage of 2500 Vac, 1
Minute
The SO-5 JEDEC registered
(MO-155) package outline does
not require “through holes” in a
PCB. This package occupies
approximately one-fourth the
footprint area of the standard
dual-in-line package. The lead
profile is designed to be com-
patible with standard surface
mount processes.
These high gain series opto-
couplers use a Light Emitting
Diode and an integrated high
gain photodetector to provide
extremely high current transfer
ratio between input and output.
Separate pins for the photodiode
and output stage results in TTL
compatible saturation voltages
and high speed operation.
Where desired the VCC and VO
terminals may be tied together
to achieve conventional photo-
darlington operation.
SO-5 Package
Standard DIP
SO-8 Package
HCPL-M700
6N138
HCPL-0700
HCPL-M701
6N139
HCPL-0701
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