...........continued

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Time within 5 °C of actual peak temperature

(tp)

10 s to 30 s

20 s to 40 s

Ramp-down rate

6 °C/second max

6 °C/second max

Time 25 °C to peak temperature

6 minutes max

8 minutes max

Figure 4-6. Classification Reflow Profiles

Table 4-5. Pb-Free Process—Package Classification Reflow Temperatures

Package Thickness

260 + 0 °C

260 + 0 °C

260 + 0 °C

260 + 0 °C

250 + 0 °C

245 + 0 °C

Greater than or equal to

250 + 0 °C

245 + 0 °C

245 + 0 °C

1.

Tolerance: The device manufacturer or supplier should assure process compatibility up to and including the

stated classification temperature, meaning that the Peak reflow temperature is +0 °C. For example, 260 °C to

0 °C, at the rated MSL value.

Note: Exceeding the ratings that are mentioned in the preceding table might cause damage to the device.

4.6

Reference Documents

• IEEE Std 802.3-2018 Clause 33 Power over Ethernet over 2-Pair and Clause 145 Power over Ethernet

• PD69210 Communication Protocol User Guide

• AN3361 Designing an IEEE 802.3af/at/bt PoE System Based on PD692x0/PD69208.

• PD69208T4, PD69204T4, and PD69208M PoE PSE Manager Datasheet

• PD69200 PoE PSE Controller Datasheet

PD69210/PD69220

Package Information

Datasheet

DS00003424A-page 16