| поискавой системы для электроныых деталей |
|
MICRF620TR датащи(PDF) 17 Page - Micrel Semiconductor |
|
|
|||||||||||||||||||||||||||||
MICRF620TR датащи(HTML) 17 Page - Micrel Semiconductor |
|
17 / 18 page ![]() Micrel, Inc. MICRF620 December 2005 17 M9999-120205 Application Circuit Illustration Figure 10. Circuit illustration of MICRF620, LDO and MCU Figure 10. shows a typical set-up with the MICRF620, a Low-Drop-Out voltage regulator (LDO) and a micro- controller (MCU). When the MICRF620 and the MCU runs on the same power supply (min 2.0, max. 2.5V), the IO can be connected directly to the MCU. If the MCU needs a higher VDD than the max. specified VDD of the MICRF620 (2.5V), voltage dividers need to be added on the IO lines not to override the max. input voltage. Figure 11 shows a recommended voltage divider circuit for a MCU running at 3.0V and the MICRF620 at 2.5V. 3k3 18k 3k3 18k 3k3 18k 15k MICRF6xx MCU CS SCLK IO DATAIXO DATACLK LD RSSI CS SCLK IO DATAIXO DATACLK LD RSSI Figure 11. How to connect MICRF620 (2.5V) and MCU (3.0V) Assembling the MICRF620 Recommended Reflow Temperature Profile When the MICRF620 module is being automatically assembled to a PCB, care must be taken not to expose the module for temperature above the maximum specified. Figure 12 shows the recommended reflow temperature profile. Figure 12. Recommended Reflow Temperature Reflow Shock/Vibration during Reflow The module has several components inside which are assembled in a reflow process. These components may reflow again when the module is assembled onto a PCB. It is therefore important that the module is not subjected to any mechanical shock or vibration during this process. Handassembling the MICRF620 It is recommended to use solder paste also during hand assembling of the module. Because of the module ground pad on the bottom side, the module will be assembled most efficient if the heat is being subjected to the bottom side of the PCB. The heat will be transferred trough the PCB due the ground vias under the module (see Layout Considerations). In addition, it is recommended to use a solder tip on the signal and power pads, to make sure the solder points are properly melted. |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |