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NIF9N05CL датащи(PDF) 1 Page - ON Semiconductor

номер детали NIF9N05CL
подробное описание детали  PROTECTED POWER MOSFET
PDF  6 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NIF9N05CL датащи(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2004
July, 2004 − Rev. 3
1
Publication Order Number:
NIF9N05CL/D
NIF9N05CL
Protected Power MOSFET
2.6 A, 52 V, N−Channel, Logic Level,
Clamped MOSFET w/ ESD Protection
in a SOT−223 Package
Benefits
• High Energy Capability for Inductive Loads
• Low Switching Noise Generation
Features
• Diode Clamp Between Gate and Source
• ESD Protection − HBM 5000 V
• Active Over−Voltage Gate to Drain Clamp
• Scalable to Lower or Higher R
DS(on)
• Internal Series Gate Resistance
Applications
• Automotive and Industrial Markets:
Solenoid Drivers, Lamp Drivers, Small Motor Drivers
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage Internally Clamped
VDSS
52−59
V
Gate−to−Source Voltage − Continuous
VGS
±15
V
Drain Current
− Continuous @ TA = 25°C
− Single Pulse (tp = 10 ms) (Note 1)
ID
IDM
2.6
10
A
Total Power Dissipation @ TA = 25°C (Note 1)
PD
1.69
W
Operating and Storage Temperature Range
TJ, Tstg
−55 to
150
°C
Single Pulse Drain−to−Source
Avalanche Energy (VDD = 50 V, ID(pk) = 1.17 A,
VGS = 10 V, L = 160 mH, RG = 25 W)
EAS
110
mJ
Thermal Resistance
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
RqJA
RqJA
74
169
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8
″ from Case for 10 s
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1
″ pad size, (Cu area 1.127 in2)
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu area 0.412 in2)
Device
Package
Shipping†
ORDERING INFORMATION
NIF9N05CLT1
SOT−223
1000/Tape & Reel
MPWR
Drain
(Pins 2, 4)
Source
(Pin 3)
Gate
(Pin 1)
RG
Overvoltage
Protection
ESD Protection
http://onsemi.com
SOT−223
CASE 318E
STYLE 3
DRAIN
GATE
DRAIN
SOURCE
(Top View)
MARKING DIAGRAM
F9N05
= Specific Device Code
A
= Assembly Location
WW
= Work Week
1
2
3
4
VDSS
(Clamped)
RDS(ON) TYP
ID MAX
52 V
107 m
Ω
2.6 A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
NIF9N05CLT3
SOT−223
4000/Tape & Reel


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