Data Sheet

HMC1048ALC3B

Rev. B | Page 15 of 15

OUTLINE DIMENSIONS

0.50

BSC

0.32

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

0.08

BSC

1

4

6

7

9

10

12

3

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.36

0.30

0.24

PIN 1

EXPOSED

PAD

PIN 1

INDICATOR

3.05

2.90 SQ

2.75

2.10 BSC

1.00 REF

1.60

1.50 SQ

1.40

0.90

0.80

0.70

SEATING

PLANE

Figure 34. 12-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-12-4)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

HMC1048ALC3B

−40°C to +85°C

MSL3

12-Terminal Ceramic LCC

E-12-4

HMC1048ALC3BTR

−40°C to +85°C

MSL3

12-Terminal Ceramic LCC

E-12-4

HMC1048ALC3BTR-R5

−40°C to +85°C

MSL3

12-Terminal Ceramic LCC

E-12-4

EV1HMC1048ALC3B

1

All models are RoHS compliant parts.

2

See the Absolute Maximum Ratings section, Table 3, and Figure 2 for the peak reflow temperature.

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D16345-0-5/19(B)