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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MIC2104 датащи(PDF) 6 Page - Microchip Technology |
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MIC2104 датащи(HTML) 6 Page - Microchip Technology |
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6 / 42 page  MIC2103/4 DS20005899A-page 6 2017 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Temperature Range TJ –40 — +125 °C — Maximum Junction Temperature — — — +150 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 10s Package Thermal Resistances Thermal Resistance 3x3 QFN-16Ld JA —50.8 — °C/W — Thermal Resistance 3x3 QFN-16Ld JC —25.3 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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