TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Ambient Temperature Range

–40

—

+85

°C

—

Storage Temperature Range

—

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 10s

Package Thermal Resistance

Thermal Resistance SOT-23-8

—

100

—

°C/W

Using 4-Layer PCB

—

70

—

°C/W

Using 4-Layer PCB

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability.

 2020 Microchip Technology Inc.

DS20006308A-page 7

MIC863