EDSTRG28PLCC datasheet(53/78 Pages) TI

53 / 78 page

RELIABILITY STRESS TESTS

2–7

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251–1443

Table 2. Definitions of Microprocessor Testing Terms (Continued)

TERM

DEFINITION/DESCRIPTION

REFERENCES

Thermal Shock

Test similar to the temperature cycle test, but involving a

liquid-to-liquid transfer.

MIL-STD-883C, Method 1011

Particle Impact Noise Detection

(PIND)

A nondestructive test to detect loose particles inside a device

cavity.

Mechanical Sequence

Fine and gross leak

Mechanical shock

PIND (optional)

Vibration, variable frequency

Constant acceleration

Fine and gross leak

Electrical test

MIL-STD-883C, Method 1014

MIL-STD-883C, Method 2002,

1500 g, 0.5 ms, Condition B

MIL-STD-883C, Method 2020

MIL-STD-883C, Method 2007,

20g, Condition A

MIL-STD-883C, Method 2001

MIL-STD-883C, Method 1014

To data sheet limits

Thermal Sequence

Fine and gross leak

Solder heat (optional)

Temperature cycle

(10 cycles minimum)

Thermal shock

(10 cycles minimum)

Moisture resistance

Fine and gross leak

Electrical test

MIL-STD-883C, Method 1014

MIL-STD-750C, Method 1014

MIL-STD-883C, Method 1010,

– 65 to + 150

°C, Condition C

MIL-STD-883C, Method 1011,

– 55 to +125

°C, Condition B

MIL-STD-883C, Method 1004

MIL-STD-883C, Method 1014

To data sheet limits

Thermal/Mechanical Sequence

Fine and gross leak

Temperature cycle

(10 cycles minimum)

Constant acceleration

Fine and gross leak

Electrical test

Electrostatic discharge

Solderability

Solder heat

Salt atmosphere

Lead pull

Lead integrity

Electromigration

Resistance to solvents

MIL-STD-883C, Method 1014

MIL-STD-883C, Method 1010,

– 65 to +150

°C, Condition C

MIL-STD-883C, Method 2001,

30 kg, Y1 Plane

MIL-STD-883C, Method 1014

To data sheet limits

MIL-STD-883C, Method 3015

MIL-STD-883C, Method 2033

MIL-STD-750C, Method 2031,

10 sec

MIL-STD-883C, Method 1009,

Condition A, 24 hrs min

MIL-STD-883C, Method 2004,

Condition A

MIL-STD-883C, Method 2004,

Condition B1

Accelerated stress testing of con-

ductor patterns to ensure accept-

able lifetime of power-on operation

MIL-STD-883C, Method 2015

Texas Instruments reserves the right to make changes in semiconductor test limits, procedures, or processes

without notice. Unless prior arrangements for notification have been make, TI advises all customers to verify

current test and manufacturing conditions prior to relying on published data.

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