RCEC ISO

www.vishay.com

Vishay MCB

Revision: 24-Apr-2020

3

Document Number: 32506

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DISSIPATION

Temperature Rise as a Function of the Power Applied

Overall Thermal Resistance 0.6 °C/W (See Assembly)

Permanent Applicate Power as a Function

of Heatsink Temperature

MECHANICAL ASSEMBLY

Head screw, low or normal height without washers.

Maximum tightening torque:

80 Ncm, mechanical mounting

130 Ncm, electrical connection

COOLING

The temperature of the heatsink may be maintained at the specified values with:

• Forced air ventilation

• Internal circulation of a liquid cooling

• Heatsink contact surface: Ra 6.3 μm

• Evenness defect: 0.05 mm max.

• Surface temperature gradient (isotherm): 20 °C max.

• Thermal compound not supplied (resistance < 0.025 °C/W / 0.05 mm)

The user must select the thermal resistance of the heatsink according to the power applied.

10

100

1000

10000

0

10

20

30

40

50

60

0

102030405060708090 100

Axis Title

Δθ = f (P)

10

100

1000

10000

0

25

50

75

100

125

050

100

150

Axis Title

θ(°C)

Maximum

ORDERING INFORMATION

RCEC

ISO

F

D

MP

100K

5 %

100K

5 %

XXX

BO15

MODEL STYLE TERMINALS

OPTION RESISTANCE

VALUE

TOLERANCE RESISTANCE

VALUE

TOLERANCE CUSTOM PACKAGING

F = faston

S = screws

Single

Double

Triple

(on request)

Common

point for

double

value

Value for

single,

first value

for double

± 5 %

± 10 %

Other on

request

Second value

for double

± 5 %

± 10 %

Other on

request