6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

0

42

V

Signal input pins

Common-mode voltage(3)

(V–) – 0.5

(V+) + 0.5

V

Differential voltage(3)

V

Current(3)

–10

10

mA

Output short-circuit(2)

Continuous

–55

150

°C

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package. Extended short-circuit current, especially with higher supply voltage, can cause

excessive heating and eventual destruction.

(3)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

2.7

40

V

Input voltage range

(V–)

(V+)

V

Specified temperature

–40

125

°C

6.4 Thermal Information for Single Channel

THERMAL METRIC(1)

OPA992, OPA992S

UNIT

DBV(2)

(SOT-23)

DCK(2)

(SC70)

DRL(2)

(SOT-553)

5 PINS

6 PINS

5 PINS

5 PINS

6 PINS

Junction-to-ambient thermal resistance

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-case (top) thermal resistance

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-board thermal resistance

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-top characterization parameter

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-board characterization parameter

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-case (bottom) thermal resistance

TBD

TBD

TBD

TBD

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for OPA992.

OPA992, OPA2992, OPA4992

SBOSA10 – JUNE 2021

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