MH1RT QualPack

2

Rev. 2 – Jan 2002

1. Table of Contents

1.

Table of Contents ................................................................................................................................................ 2

2.

General Information ........................................................................................................................................... 3

3.

Technology Information .................................................................................................................................... 4

3.1

Wafer Process Technology ........................................................................................................................ 4

3.2

Product Design ........................................................................................................................................... 5

3.3

Cross Section............................................................................................................................................... 6

4.

Qualification........................................................................................................................................................ 7

4.1

Qualification methodology ........................................................................................................................ 7

4.2

Qualification test methods ......................................................................................................................... 8

4.3

Wafer Process Qualification...................................................................................................................... 9

4.3.1

Wafer Level Reliability....................................................................................................................... 9

4.3.2

Hot carrier qualification ....................................................................................................................... 9

4.3.3

Electromigration................................................................................................................................. 10

4.3.4

Product Reliability Results................................................................................................................. 12

4.4

Product Qualification............................................................................................................................... 13

4.4.1

Device reliability................................................................................................................................ 13

4.4.2

Packaging Reliability ......................................................................................................................... 14

4.5

Qualification status: ................................................................................................................................. 14

4.6

Irradiation................................................................................................................................................. 15

4.6.1

Conditions and Chronology ............................................................................................................... 15

4.6.2

Results ................................................................................................................................................ 16

4.6.3

Irradiation summary ........................................................................................................................... 16

4.6.4

Irradiation test records........................................................................................................................ 17

5.

Environmental Information.............................................................................................................................. 20

6.

Other Data ......................................................................................................................................................... 21

6.1

ISO9001 and QS900 Certificates ............................................................................................................ 21

6.2

Data Book Reference................................................................................................................................ 22