поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

Preview PDF HTML

MCP661 датащи(PDF) 20 Page - Microchip Technology

номер детали MCP661
подробное описание детали  60 MHz, 32 V/關s Rail-to-Rail Output (RRO) Op Amps
PDF  68 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP661 датащи(HTML) 20 Page - Microchip Technology

Back Button MCP661 Datasheet HTML 16Page - Microchip Technology MCP661 Datasheet HTML 17Page - Microchip Technology MCP661 Datasheet HTML 18Page - Microchip Technology MCP661 Datasheet HTML 19Page - Microchip Technology MCP661 Datasheet HTML 20Page - Microchip Technology MCP661 Datasheet HTML 21Page - Microchip Technology MCP661 Datasheet HTML 22Page - Microchip Technology MCP661 Datasheet HTML 23Page - Microchip Technology MCP661 Datasheet HTML 24Page - Microchip Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 20 / 68 page
background image
MCP660/1/2/3/4/5/9
DS20002194E-page 20
 2009-2014 Microchip Technology Inc.
3.1
Analog Outputs
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs
The non-inverting and inverting inputs (VIN+, VIN-, …)
are high-impedance CMOS inputs with low bias
currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 2.5V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In that case, VSS is connected to
Ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Chip Select Digital Input (CS)
The input (CS) is a CMOS, Schmitt-triggered input that
places the part into a low-power mode of operation.
3.5
Exposed Thermal Pad (EP)
There is an internal connection between the exposed
thermal pad (EP) and the VSS pin; they must be
connected to the same potential on the printed circuit
board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
JA).



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com