DTO35

www.vishay.com

Vishay Sfernice

Revision: 24-Oct-2019

1

Document Number: 51078

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Surface Mounted Power Resistor Thick Film Technology

ADDITIONAL RESOURCES

FEATURES

• AEC-Q200 qualified

• 35 W at 25 °C case temperature

• Surface mounted resistor - TO-252 (DPAK)

style package

• Wide resistance range: 0.016

 to 700 k

• Non inductive

• Resistor isolated from metal tab

• Solder reflow secure at 270 °C / 10 s, MSL = 1

• Material categorization: for definitions of compliance

Notes

• For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C

• Power dissipation is 4.5 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of

copper, 39 mm x 30 mm x 1.6 mm, with thermal vias

• For other information about dissipation, see the Application Note 52027: “Thermal Management on SMD Thick Film Resistors (D2TO20,

D2TO35, DTO25, DTO35)”

333

DDD3 D

3D Models

DIMENSIONS in millimeters

STANDARD ELECTRICAL SPECIFICATIONS

MODEL

SIZE

RESISTANCE

RANGE



RATED POWER

W

LIMITING ELEMENT

V

TOLERANCE

± %

TEMPERATURE

COEFFICIENT

± ppm/°C

CRITICAL

RESISTANCE



DTO35

TO-252 (DPAK)

0.016 to 700K

35

500

1, 2, 5, 10

150

7.1K

7.87

2.54

1.65

1.65

2.54

Footprint recommendation for

solderable contact area:

Tolerance unspecified: ± 0.3

8.2

0.8 ± 0.1

1.4 +0.2 /-0

0.8 ± 0.1

2.8

1.6 ± 0.1

0.6 ± 0.1

1.2

6.35

10°

5.08

MECHANICAL SPECIFICATIONS

Mechanical Protection

Molded

Resistive Element

Thick film

Substrate

Alumina

Connections

Tinned copper, Ni under layer

Weight

2 g max.

ENVIRONMENTAL SPECIFICATIONS

Temperature Range

-55 °C to +175 °C

Climatic Category

55 / 175 / 56

Flammability

IEC 60695-11-5

2 applications 30 s

separated by 60 s

ELECTRICAL SPECIFICATIONS

Tolerances

From 0.016

 to 0.047 :

± 5 % and ± 10 %

> 0.047

 to 0.1 :

± 2 % to ± 10 %

 0.11 : ± 1 % to ± 10 %

Power Rating and Thermal

Resistance

35 W at +25 °C case

Temperature Coefficient

See Special Feature table

± 150 ppm/°C

Dielectric Strength

(between terminals and board)

Insulation Resistance

Inductance

 0.1 μH