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HMC525ALC4TR-R5 датащи(PDF) 27 Page - Analog Devices

номер детали HMC525ALC4TR-R5
подробное описание детали  4 GHz to 8.5 GHz, GaAs, MMIC, I/Q Mixer
PDF  28 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

HMC525ALC4TR-R5 датащи(HTML) 27 Page - Analog Devices

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Data Sheet
HMC525ALC4
Rev. A | Page 27 of 28
SOLDERING INFORMATION AND RECOMMENDED
LAND PATTERN
Figure 102 shows the recommended land pattern for the
HMC525ALC4. The HMC525ALC4 is contained in a 4 mm ×
4 mm, 24-terminal, ceramic LCC package, with an exposed
ground pad (EPAD). This pad is internally connected to the
ground of the chip. To minimize thermal impedance and ensure
electrical performance, solder the pad to the low impedance
ground plane on the PCB. It is recommended that the ground
planes on all layers under the pad be stitched together with vias,
to further reduce thermal impedance. The land pattern on the
EV1HMC525ALC4 evaluation board provides a simulated
thermal resistance (θJC) of 161°C/W.
.010" REF
.030"
MASK OPENING
.098" SQUARE MASK OPENING
.020 × 45" CHAMFER FOR PIN 1
.106" SQUARE
GROUND PAD
.116"
MASK
OPENING
PIN 1
.0197"
[0.50]
.034"
TYPICAL
VIA
SPACING
PAD SIZE
.026" × .010"
ᶲ .010"
TYPICAL VIA
GROUND PAD
SOLDERMASK
.004" MASK/METAL OVERLAP
.178" SQUARE
.010" MIN MASK WIDTH
Figure 102. Evaluation Board Land Pattern for the HMC525ALC4 Package
Figure 103. Evaluation PCB Top Layer



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