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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MICRF600 датащи(PDF) 17 Page - Micrel Semiconductor |
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MICRF600 датащи(HTML) 17 Page - Micrel Semiconductor |
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17 / 19 page  Micrel, Inc. MICRF600 September 2005 17 M9999-091905 Application Circuit Illustration MICRF600 4004 LDO MCU Figure 10. Circuit illustration of MICRF600, LDO and MCU Figure 10 shows a typical set-up with the MICRF600, a Low-Drop-Out voltage regulator (LDO) and a micro- controller (MCU). When the MICRF600 and the MCU runs on the same power supply (min 2.0, max. 2.5V), the IO can be connected directly to the MCU. If the MCU needs a higher VDD than the maximum specified VDD of the MICRF600 (2.5V), voltage dividers need to be added on the IO lines not to override the max. input voltage. Figure 11 shows a recommended voltage divider circuit for a MCU running at 3.0V and the MICRF600 at 2.5V. 3k3 18k 3k3 18k 3k3 18k 15k MICRF6xx MCU CS SCLK IO DATAIXO DATACLK LD RSSI CS SCLK IO DATAIXO DATACLK LD RSSI Figure 11. How to connect MCU600 (2.5V) and MCU (3.0V) Assembling the MICRF600 Recommended Reflow Temperature Profile When the MICRF600 module is being automatically assembled to a PCB, care must be taken not to expose the module for temperature above the maximum specified. Figure 12 shows the recommended reflow temperature profile. Figure 12. Recommended Reflow Temperature Reflow Shock/Vibration during Reflow The module has several components inside which are assembled in a reflow process. These components may reflow again when the module is assembled onto a PCB. It is therefore, important that the module is not subjected to any mechanical shock or vibration during this process. Handassembling the MICRF600 It is recommended that solder paste also be used during hand assembling of the module. Because of the module ground pad on the bottom side, the module will be assembled most efficiently if the heat is being subjected to the bottom side of the PCB. The heat will be transferred trough the PCB due the ground vias under the module (see Layout Considerations). In addition, it is recommended that a solder tip be used on the signal and power pads. This will ensure that the solder points are properly melted. |
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