RF01009, Rev. B (5/7/13)

©2013 Microsemi Corporation

Page 2 of 5

MLCE6.5 – MLCE170A

MAXIMUM RATINGS @ 25 ºC unless otherwise stated

Parameters/Test Conditions

Symbol

Value

Unit

Junction and Storage Temperature

-65 to +150

ºC

Thermal Resistance Junction-to-Lead

(1)

22

ºC/W

Peak Pulse Power dissipation @ 25 ºC (at 10/1000

µs,

see Figures 1, 2, and 3)

(2)

1500

W

Rated Average Power Dissipation

(1)

5.0

1.52

W

Solder Temperature @ 10 s

260

Notes: 1. At 3/8 inch (10 mm) from body, or 82 ºC/W junction to ambient when mounted on FR4 PC board with 4 mm2 copper pads (1oz), track width

1 mm, length 25mm.

2. With a impulse repetition rate of 0.01% or less. TVS devices are not typically used for dc power dissipation and are instead operated at

≤ V

Application Schematics for further protection details in rated peak power for unidirectional and bidirectional configurations respectively.

MECHANICAL and PACKAGING

• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.

• TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.

• MARKING: Part number.

• POLARITY: Cathode indicated by band.

• TAPE & REEL option: Standard per EIA-296 (add “TR” suffix to part number). Consult factory for quantities.

• WEIGHT: Approximately 1.5 grams.

• See Package Dimensions on last page.

PART NOMENCLATURE

M

LC

E

6.5

A

e3

Reliability Level

M

MA

MX

MXL

*(see High Reliability

Non-Hermetic Product

Portfolio)

Low Capacitance

Rated

RoHS Compliance

e3 = RoHS Compliant

Blank = non-RoHS Compliant

Tolerance Level

A = +/- 5%

Blank = +/- 10%

Reverse Stand-Off Voltage

(see Electrical Characteristics

table)

Encapsulated Plastic Package