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MCP47FXBX4 датащи(PDF) 53 Page - Microchip Technology

номер детали MCP47FXBX4
подробное описание детали  8/10/12-Bit Quad/Octal Voltage Output, 6 LSb INL Digital-to-Analog Converters with I짼C Interface
PDF  124 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP47FXBX4 датащи(HTML) 53 Page - Microchip Technology

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 2020 Microchip Technology Inc.
DS20006368A-page 53
MCP47FXBX4/8
4.0
GENERAL DESCRIPTION
The MCP47FXBX4 (MCP47FXB04, MCP47FXB14,
and MCP47FXB24) devices are quad-channel voltage
output devices. The MCP47FXBX8 (MCP47FXB08,
MCP47FXB18 and MCP47FXB28) devices are octal-
channel voltage output devices.
These devices are offered with 8-bit (MCP47FXB0X),
10-bit (MCP47FXB1X) and 12-bit (MCP47FXB2X) res-
olutions and include nonvolatile memory (EEPROM),
an I2C serial interface and two write Latch pins (LAT0,
LAT1) to control the update of the written DAC value to
the DAC output pin.
The devices use a resistor ladder architecture. The
resistor ladder DAC is driven from a software-
selectable voltage reference source. The source can
be either the device’s internal VDD, an external VREF
pin voltage (buffered or unbuffered), or an internal
band gap voltage source.
The DAC output is buffered with a low power and
precision output amplifier (op amp). This output
amplifier provides a rail-to-rail output with low offset
voltage and low noise. The gain (1x or 2x) of the out-
put buffer is software configurable.
This device family also has user-programmable non-
volatile memory (EEPROM) option, which allows the
user to save the desired POR/BOR value of the DAC
register and device Configuration bits.
High-voltage lock bits can be used to ensure that the
device’s output settings are not accidentally modified.
The device operates from a single-supply voltage. This
voltage is specified from 2.7V to 5.5V for full specified
operation, and from 1.8V to 5.5V for digital operation.
The device can operate between 1.8V and 2.7V, but its
analog performance is significantly reduced; therefore,
most device parameters are not specified for this
range.
The main functional blocks are:
• Power-on Reset/Brown-out Reset (POR/BOR)
• Device Memory
• Resistor Ladder
• Output Buffer/VOUT Operation
• Internal Band Gap
•I2C Serial Interface Module
4.1
Power-on Reset/Brown-out Reset
(POR/BOR)
The internal POR/BOR circuit monitors the power
supply voltage (VDD) during operation. This circuit
ensures correct device start-up at system power-up
and power-down events. The device’s RAM retention
voltage (VRAM) is lower than the POR/BOR voltage trip
point (VPOR/VBOR). The maximum VPOR/VBOR voltage
is less than 1.8V.
POR occurs as the voltage rises (typically from 0V),
while BOR occurs as the voltage falls (typically from
VDD(MIN) or higher).
The POR and BOR trip points are at the same voltage and
the condition is determined by whether the VDD voltage is
rising or falling (see Figure 4-1). What occurs is different
depending on whether the reset is a POR or BOR.
When
VPOR/VBOR <VDD < 2.7V,
the
electrical
performance
may
not
meet
the
data
sheet
specifications. In this region, the device is capable of
reading and writing to its EEPROM and reading and
writing to its volatile memory if the proper serial
command is executed.



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