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MCP47FXBX4 датащи(PDF) 53 Page - Microchip Technology |
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MCP47FXBX4 датащи(HTML) 53 Page - Microchip Technology |
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53 / 124 page ![]() 2020 Microchip Technology Inc. DS20006368A-page 53 MCP47FXBX4/8 4.0 GENERAL DESCRIPTION The MCP47FXBX4 (MCP47FXB04, MCP47FXB14, and MCP47FXB24) devices are quad-channel voltage output devices. The MCP47FXBX8 (MCP47FXB08, MCP47FXB18 and MCP47FXB28) devices are octal- channel voltage output devices. These devices are offered with 8-bit (MCP47FXB0X), 10-bit (MCP47FXB1X) and 12-bit (MCP47FXB2X) res- olutions and include nonvolatile memory (EEPROM), an I2C serial interface and two write Latch pins (LAT0, LAT1) to control the update of the written DAC value to the DAC output pin. The devices use a resistor ladder architecture. The resistor ladder DAC is driven from a software- selectable voltage reference source. The source can be either the device’s internal VDD, an external VREF pin voltage (buffered or unbuffered), or an internal band gap voltage source. The DAC output is buffered with a low power and precision output amplifier (op amp). This output amplifier provides a rail-to-rail output with low offset voltage and low noise. The gain (1x or 2x) of the out- put buffer is software configurable. This device family also has user-programmable non- volatile memory (EEPROM) option, which allows the user to save the desired POR/BOR value of the DAC register and device Configuration bits. High-voltage lock bits can be used to ensure that the device’s output settings are not accidentally modified. The device operates from a single-supply voltage. This voltage is specified from 2.7V to 5.5V for full specified operation, and from 1.8V to 5.5V for digital operation. The device can operate between 1.8V and 2.7V, but its analog performance is significantly reduced; therefore, most device parameters are not specified for this range. The main functional blocks are: • Power-on Reset/Brown-out Reset (POR/BOR) • Device Memory • Resistor Ladder • Output Buffer/VOUT Operation • Internal Band Gap •I2C Serial Interface Module 4.1 Power-on Reset/Brown-out Reset (POR/BOR) The internal POR/BOR circuit monitors the power supply voltage (VDD) during operation. This circuit ensures correct device start-up at system power-up and power-down events. The device’s RAM retention voltage (VRAM) is lower than the POR/BOR voltage trip point (VPOR/VBOR). The maximum VPOR/VBOR voltage is less than 1.8V. POR occurs as the voltage rises (typically from 0V), while BOR occurs as the voltage falls (typically from VDD(MIN) or higher). The POR and BOR trip points are at the same voltage and the condition is determined by whether the VDD voltage is rising or falling (see Figure 4-1). What occurs is different depending on whether the reset is a POR or BOR. When VPOR/VBOR <VDD < 2.7V, the electrical performance may not meet the data sheet specifications. In this region, the device is capable of reading and writing to its EEPROM and reading and writing to its volatile memory if the proper serial command is executed. |
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