４－６．Reflow Profile

For reflow profile, please refer to the conditions below:(※)

■Meaning of marks, Conditions

Mark

Meanings

Conditions

230〜260℃

Retention time for TL Within 40sec.

Peak temperature

260℃(Max)

Maximum of pre-heating temperature

180℃

Minimum of pre-heating temperature

140℃

Time from Tsmin to Tsmax

Over 60sec.

a) Heating method

Time for peak temperature

Within 10sec.

Temperature rising rate

Under 3℃/sec.

Temperature decreasing rate

Over -3℃/sec.

Heating on PCB pattern, not direct to the

LED. (Fig-1)

Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu

②HAND SOLDERING CONDITION

LED products do not contain reinforcement material such as a glass fillers.

RECOMMENDED CONDITION

Condition ) Temp. of iron top less than

350℃ within 3 sec.

※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and

reflow furnaces before using, because stress from circuit boards and temperature variations of reflow

４－７．Attention Points in Soldering Operation

This product was developed as a surface mount LED especially suitable for reflow soldering.

①SOLDER USED

furnaces vary by customer’s own conditions.

So thermal stress by soldering greatly influence its reliability.

Please keep following points for manual soldering.

ITEM

Reference temperature

４－８．Cleaning after Soldering

Please follow the conditions below if the cleaning is necessary after soldering.

Ultrasonic Cleaning

15W／Below 1 liter (capacity of tank)

Drying

Under 100℃ within 3 minutes

Solvent

We recommend to use alcohols solvent such as, isopropyl alcohols

Temperature

Under 30℃ within 3 minutes

b)

Handling after

soldering

Please handle after the part temp.

goes down to room temp.

So reflow soldering is recommended. In case of implementing manual soldering,

please take care of following points.

Fig.-1

SOLDERING LAND

SOLDERING IRON

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