High Brightness Type Mini-molded chip LEDs

SML31＊ Series

SURFACE MOUNT LED LAMPS

(Typ.)

The recommended thickness of the screen mask

for soldering is between 100 and 200μm. The

hole size of the screen mask should be same as

the recommended land pattern or smaller.

1608

(0603)

1.6

×0.8

t=0.8

1.2

1.6

＋0.2

0

1.0

Relative brightness (

%)

0

50

100

50

100

0

°

30

°

60

°

90

°

30

°

60

°

90

°

Part No.

SML310BAT

SML311BBT

SML312BCT

SML311EBT

Forward

voltage

Light wavelength

Reverse

current

Brightness

3.8

3.5

3.8

20

100

5

428

468

523

518

36

14

1.4

90

22

63

90

200

22

3.6

36

26

65

20

20

(mA)

Typ.

(V)

Typ.

(mcd)

Typ.

(nm)

λp

Typ.

(nm)

Min.

(

(mA)

(mA)

Max.

(

µA)

Resin Color

Transparent

Clear

SML310BAT

SML311BBT

SML312BCT

SML311EBT

SML312ECT

Peak

forward

current

（mA）

Part No.

Power

dissipation

（mW）

Forward

current

（mA）

Reverse

voltage

（V）

Operating

temperature

（

°C）

Stotage

temperature

（

°C）

Emitting

color

94

84

20

70

100

5

-30 to +85

-40 to +100

Blue

Green

Terminal

Cathode mark

Tolerance:

±0.1

(V)

Peak Half-wave

∆λ

SML312ECT

36

0.8

Feeding direction

2

4

φ1.5

1.1

1.0

φ13

φ60

φ180

Package Size

（mm）

Tape Spacifications：T86〈3,000pcs／reel〉

Reel Spacifications

Note) "-" will be taken out for emitting color B/E series.

（Unit：mm）

Y’

X’

Blue

Green

468nm

525nm

GaN on SiC

428nm

SML310BAT

SML311BBT

SML312BCT

SML311EBT

SML312ECT

InGaN on SiC