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TPSA20xxY CHIP INFORMATION

91

74

CHIP THICKNESS:15TYPICAl

BONDINGPADS:4x4MINIMUM

°

TOLERANCES ARE 10%.

±

ALL DIMENSIONS AREINMILS.

OUT

OUT

OUT

OC

GND

IN

IN

EN

TPS20xxY

(1)

(2)

(3)

(4)

(8)

(7)

(6)

(5)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

BONDINGPAD ASSIGNMENTS

TPS2014

TPS2015

SLVS159D – DECEMBER 1996 – REVISED SEPTEMBER 2007

This chip, when properly assembled, displays characteristics similar to those of the TPS20xx. Ultrasonic bonding

may be used on the doped aluminium bonding pads. The chip may be mounted with conductive epoxy or a

gold-silicon preform.

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

EN

4

I

Enable input. Logic low at EN turns the power switch on.

GND

1

I

Ground

IN

2, 3

I

Input voltage

OC

5

O

OC is asserted active low during a fault condition.

OUT

6-8

O

Power switch output

Copyright © 1996–2007, Texas Instruments Incorporated

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Product Folder Link(s): TPS2014 TPS2015