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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MSM150 датащи(PDF) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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MSM150 датащи(HTML) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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2 / 2 page  Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.06.2014 2/2 www.leiditech.com MSM150 BB A Cooling Soldering Preheating Time(s) 120 10 to 20 30 to 90 300 260 160 250 200 150 100 50 0 Solder Reflow Recommendations Solder Pad Layouts A B C Part number (mm) (mm) (mm) MSM150 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. |
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