TC210

192-

× 165-PIXEL CCD IMAGE SENSOR

SOCS009B – OCTOBER 1986 – REVISED MAY 1990

Copyright

2-3

POST OFFICE BOX 655303

Vertical Transfers

Burn-In, Residual Imaging, Image

Distortion, Image Lag, or Microphonics

– 2640

µm by 2640 µm

– 192 Pixels (H) by 165 Pixels (V)

– Each Pixel 13.75

µm (H) by 16 µm (V)

description

The TC210 is a full-frame charge-coupled device (CCD) image sensor designed specifically for medical and

industrial applications requiring ruggedness and small size. The image-sensing area is configured into 165

horizontal lines each containing 192 pixels. Twelve additional pixels are provided at the end of each line to

establish a dark reference and line clamp. The antiblooming feature is activated by supplying clock pulses to

the antiblooming gate, an integral part of each image-sensing element. The charge is converted to signal voltage

at 4

µV per electron by a high-performance structure with built-in automatic reset and a voltage-reference

generator. The signal is further buffered by a low-noise two-stage source-follower amplifier to provide high

output-drive capability.

The TC210 is supplied in a 5-mm (0.20-in) diameter ceramic and clear plastic molded package with a glass

window. The glass window can be cleaned using any standard method for cleaning optical assemblies or by

wiping the surface with a cotton swab soaked in alcohol.

The TC210 is characterized for operation from – 10

°C to 45°C.

This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together

or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to VSS. Under no

circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUT to VSS during operation to prevent

damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is

allowed to flow. Specific guidelines for handling devices of this type are contained in the publication

Guidelines for Handling

Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.

ADB 3

VSS 2

ABG 1

4 OUT

5 SRG

6 IAG

DUAL-IN-LINE PACKAGE

(TOP VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.