TSOP−5

CASE 483

ISSUE N

DATE 12 AUG 2020

SCALE 2:1

1

5

XXX MG

G

GENERIC

MARKING DIAGRAM*

1

5

0.7

0.028

1.0

0.039

mm

inches

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

XXX = Specific Device Code

A

= Assembly Location

Y

= Year

W

= Work Week

G

= Pb−Free Package

1

5

XXXAYWG

G

Discrete/Logic

Analog

(Note: Microdot may be in either location)

XXX = Specific Device Code

M

= Date Code

G

= Pb−Free Package

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION A.

5. OPTIONAL CONSTRUCTION: AN ADDITIONAL

TRIMMED LEAD IS ALLOWED IN THIS LOCATION.

TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2

FROM BODY.

DIM

MIN

MAX

MILLIMETERS

A

B

C

0.90

1.10

D

0.25

0.50

G

0.95 BSC

H

0.01

0.10

J

0.10

0.26

K

0.20

0.60

M

0

10

S

2.50

3.00

12

3

54

S

A

G

B

D

H

C

J

__

0.20

5X

C AB

T

0.10

2X

2X

T

0.20

NOTE 5

PLANE

0.05

K

M

DETAIL Z

DETAIL Z

TOP VIEW

SIDE VIEW

A

B

END VIEW

1.35

1.65

2.85

3.15

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98ARB18753C

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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TSOP−5

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