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HD3SS213 датащи(PDF) 2 Page - Texas Instruments |
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HD3SS213 датащи(HTML) 2 Page - Texas Instruments |
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2 / 29 page ![]() Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 5 6.1 Absolute Maximum Ratings........................................ 5 6.2 ESD Ratings............................................................... 5 6.3 Recommended Operating Conditions.........................5 6.4 Thermal Information....................................................6 6.5 Electrical Characteristics.............................................6 6.6 Timing Requirements..................................................7 6.7 Typical Characteristics................................................ 9 7 Detailed Description......................................................10 7.1 Overview................................................................... 10 7.2 Functional Block Diagram......................................... 10 7.3 Feature Description...................................................11 7.4 Device Functional Modes..........................................11 8 Application and Implementation.................................. 12 8.1 Application Information............................................. 12 8.2 Typical Applications.................................................. 13 9 Layout.............................................................................16 9.1 Layout Guidelines..................................................... 16 9.2 Layout Example........................................................ 17 10 Device and Documentation Support..........................18 10.1 Receiving Notification of Documentation Updates..18 10.2 Support Resources................................................. 18 10.3 Trademarks.............................................................18 10.4 Electrostatic Discharge Caution..............................18 10.5 Glossary..................................................................18 11 Mechanical, Packaging, and Orderable Information.................................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (December 2016) to Revision C (January 2021) Page • NOTE: The device in the MicroStar Jr. BGA packaging were redesigned using a laminate nFBGA package. This nFBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar Jr. BGA. The new package designator in place of the discontinued package designator will be updated throughout the datasheet......................................................................................................................1 • Changed u*jr BGA to nFBGA............................................................................................................................. 1 • Changed ZQE to ZXH.........................................................................................................................................3 • Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.................................................................................6 • Changed u*jr BGA to nFBGA........................................................................................................................... 10 Changes from Revision A (September 2013) to Revision B (December 2016) Page • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ............................................................................................................................................................................1 • Added A2 to J4 row in Pin Functions table......................................................................................................... 3 Changes from Revision * (September 2013) to Revision A (September 2013) Page • Deleted Ordering Information............................................................................................................................. 3 HD3SS213 SLAS901C – DECEMBER 2016 – REVISED JANUARY 2021 www.ti.com 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: HD3SS213 |
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