ESDA05 datasheet(2/5 Pages) LEIDITECH

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1-3 Reliability testing procedures

Reliability

parameter

Test

Test methods and remarks

Test requirement

Pulse current

capability

Imax

8/20

㎲

IEC 1051-1, Test 4.5.

10 pulses in the same direction at 2

pulses per minute at maximum peak

current

Vn/Vn≤ 10%

no visible damage

Electrostatic

discharge

capability

ESD

C=150 pF,

R=330

Ω

IEC 1000-4-2

Each

times

positive/negative

direction in 10 sec at 8KV contact

discharge (Level 4)

Vn/Vn≤ 10%

no visible damage

Environmenta

l reliability

Thermal shock

IEC 68-2-14

Condition for 1 cycle

Step 1 : Min.

–40℃, 30±3 min.

Step 2 : Max. +125

℃, 30±3 min.

Number of cycles: 30 times

Vn/Vn≤ 5%

no visible damage

Low temperature

IEC 68-2-1

Place the chip at -40

±5℃ for 1000±

12hrs. Remove and place for 24

±2hrs at

room temp. condition, then measure

Vn/Vn≤ 5%

no visible damage

High temperature

IEC 68-2-2

Place the chip at 125

±5℃ for 1000±

24hrs. Remove and place for 24

±2hrs at

room temp. condition, then measure

Vn/Vn≤ 5%

no visible damage

Heat resistance

IEC 68-2-3

Apply the rated voltage for 1000

±48hrs at

±3℃. Remove and place for 24±2hrs

at room temp. condition, then measure

Vn/Vn≤ 5%

no visible damage

Humidity

resistance

IEC 68-2-30

Place the chip at 40

±2℃ and 90 to 95%

humidity for 1000

±24hrs. Remove and

place

for

±2hrs at room temp.

condition, then measure

Vn/Vn≤ 10%

no visible damage

Pressure cooker

test

Place the chip at 2 atm, 120

℃, 85%RH

for 60 hrs. Remove and place for 24

2hrs at room temp. condition, then

measure

Vn/Vn≤ 10%

no visible damage

ESDA05

Rev :

www.leiditech.com

01.06.2018

2/5

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