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HLMP-ED25-RUT00 датащи(PDF) 11 Page - Broadcom Corporation. |
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HLMP-ED25-RUT00 датащи(HTML) 11 Page - Broadcom Corporation. |
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11 / 13 page ![]() 11 Ammo Pack Drawing Example of Wave Soldering Temperature Profile for TH LED Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. 0 30 40 90 100 250 200 150 100 50 TIME (SECONDS) PREHEAT TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin ux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be suciently cooled to room temperature before exerting 10 20 60 70 80 50 mechanical force. 18.00 ± 0.50 (0.7087 ± 0.0197) 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.0246) 12.70 ± 0.30 (0.50 ± 0.0118) CATHODE 0.70 ± 0.20 (0.0276 ± 0.0079) 20.50 ± 1.00 (0.807 ± 0.039) A A VIEW A–A ∅ 4.00 ± 0.20 (0.1575 ± 0.008) TYP. ALL DIMENSIONS IN MILLIMETERS (INCHES). NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. |
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