Rev1.0, April 30, 2019

www.seoulsemicon.com

SWW0CS10B – WICOP-C G2HL

15

Reflow Soldering Characteristics

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp)

3° C/second max.

3° C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-180 seconds

Time maintained above:

- Temperature (TL)

- Time (tL)

183 °C

60-150 seconds

217 °C

60-150 seconds

Peak Temperature (Tp)

215℃

260℃

Time within 5°C of actual Peak

Temperature (tp)2

10-30 seconds

20-40 seconds

Ramp-down Rate

6 °C/second max.

6 °C/second max.

Time 25°C to Peak Temperature

6 minutes max.

8 minutes max.

IPC/JEDEC J-STD-020

Caution

1.

Reflow soldering is recommended not to be done more than three times. In the case of more

than 24 hours passed soldering after first, LEDs will be damaged.

2.

Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,

suitable tools must be used.

3.

When soldering, do not put stress on the LEDs during heating.

4.

After soldering, do not warp the circuit board.