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DS20005972A-page 18

 2018 Microchip Technology Inc.

6-Lead Low 7 mm x 5 mm LGA Package Outline and Recommended Land Pattern

B

A

0.10 C

0.10 C

0.10

C A B

0.05

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

12

N

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 1

2

1

N

0.07 C

Microchip Technology Drawing C04-1071A Sheet 1 of 2

2X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

6-Lead Low Profile Land Grid Array [APA] - 7x5 mm Body (LLGA)

D

E

6X b

L

L1

e

E1

A A2

A1