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LTC4355 датащи(PDF) 13 Page - Analog Devices |
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LTC4355 датащи(HTML) 13 Page - Analog Devices |
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13 / 24 page ![]() LT4356-3 13 Rev D For more information www.analog.com APPLICATIONS INFORMATION MOSFET stress is the result of power dissipated within the device. For long duration surges of 100ms or more, stress is increasingly dominated by heat transfer; this is a matter of device packaging and mounting, and heat sink thermal mass. This is analyzed by simulation, using the MOSFET thermal model. For short duration transients of less than 100ms, MOSFET survival is increasingly a matter of safe operating area (SOA), an intrinsic property of the MOSFET. SOA quanti- fies the time required at any given condition of VDS and ID to raise the junction temperature of the MOSFET to its rated maximum. MOSFET SOA is expressed in units of watt-squared-seconds(P2t).Thisfigureisessentiallycon- stant for intervals of less than 100ms for any given device type, and rises to infinity under DC operating conditions. Destruction mechanisms other than bulk die temperature distort the lines of an accurately drawn SOA graph so that P2t is not the same for all combinations of ID and VDS. In particular P2t tends to degrade as VDS approaches the maximum rating, rendering some devices useless for absorbing energy above a certain voltage. Calculating Transient Stress To select a MOSFET suitable for any given application, the SOA stress must be calculated for each input transient whichshallnotinterruptoperation.Itisthenasimplematter to chose a device which has adequate SOA to survive the maximumcalculatedstress.P2tforaprototypicaltransient waveform is calculated as follows (Figure 4). Let a = VREG – VIN b = VPK – VIN (VIN = Nominal Input Voltage) Then P2t =ILOAD2 1 3 tr (b a)3 b + 1 2 2a2 ln b a + 3a2 +b2 4ab Typically VREG ≈ VIN and t >> tr simplifying the above to P2t = 1 2 ILOAD2 (VPK – VREG)2 τ (W2s) For the transient conditions of VPK = 80V, VIN = 12V, VREG = 16V, tr = 10µs and t = 1ms, and a load current of 3A, P2t is 18.4W2s—easily handled by a MOSFET in a D-pak package.TheP2tofothertransientwaveshapesisevaluated by integrating the square of MOSFET power versus time. Calculating Short-Circuit Stress SOA stress must also be calculated for short-circuit condi- tions. Short-circuit P2t is given by: P2t = (VIN • ΔVSNS/RSNS)2 • tTMR (W2s) where, ΔVSNS is the SENSE pin threshold, and tTMR is the overcurrent timer interval. For VIN = 14.7V, VSNS = 50mV, RSNS = 12mΩ and CTMR = 100nF, P2t is 6.6W2s—less than the transient SOA calculated in the previous example. Nevertheless, to accountforcircuittolerancesthisfigureshouldbedoubled to 13.2W2s. Limiting Inrush Current and GATE Pin Compensation The LT4356-3 limits the inrush current to any load capaci- tance by controlling the GATE pin voltage slew rate. An external capacitor can be connected from GATE to ground to slow down the inrush current further at the expense of slower turn-off time. The gate capacitor is set at: C1 = IGATE(UP) IINRUSH •CL Figure 4. Safe Operating Area Required to Survive Prototypical Transient Waveform VPK τ VIN 43563 F04 VREG tr |
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