RF to IF Dual Downconverting Mixer

698 - 915 MHz F1100NBGI

IDT Zero-Distortion

14

RevO, Feb 2013

F1100

DATASHEET

Pin

Name

Function

1

RF_A

Main Channel RF Input. Internally matched to 50 . DO NOT

apply DC to these pins

2, 8, 20

RF_Artn,

RF_Brtn, LO_rtn

Transformer Ground Returns. Ground these pins.

3, 5, 7, 18, 24,

28

GND

Ground these pins.

4, 6, 12, 15,

31, 23, 26, 34

N.C.

No Connection. Not internally connected. OK to connect to Vcc.

OK to connect to GND

10, 16, 21, 30,

36

VCC

Power Supply. Bypass to GND with capacitors shown in the

Typical Application Circuit as close as possible to pin.

9

RF_B

Diversity Channel RF Input. Internally matched to 50

11

IF_BiasB

Connect the specified resistor from this pin to ground to set the

bias for the Diversity IF amplifier. This is NOT a current set

resistor

13, 14

IFB+, IFB-

Diversity Mixer Differential IF Output. Connect pullup inductors

from each of these pins to VCC (see the Typical Application

Circuit).

17

LO1_ADJ

Connect the specified resistor for either Standard or LC mode

from this pin to ground to set the LO common buffer Icc

19, 27

LO_in

LO_in_alt

Local Oscillator Input. Connect the LO to this port through the

recommended coupling capacitor. Note that you can only

from the unused port.

25

NC

Make Certain this pin is not connected. It is normally reserved

for selecting low current mode which the F1100 does not offer

22

STBY

STBY Mode. Pull this pin high for Standby mode (~28 mA). Pull

low or Ground for normal Operation

29

LO2_ADJ

Connect the specified resistor for either Standard or LC mode

from this pin to ground to set the LO drive buffers Icc

32, 33

IFA-, IFA+

Main Mixer Differential IF Output. Connect pullup inductors from

each of these pins to VCC (see the Typical Application Circuit).

35

IF_BiasA

Connect the specified resistor from this pin to ground to set the

bias for the Main IF amplifier. This is NOT a current set resistor

— EP

Exposed Pad. Internally connected to GND. Solder this exposed

pad to a PCB pad that uses multiple ground vias to provide heat

transfer out of the device into the PCB ground planes. These

multiple via grounds are also required to achieve the noted RF

performance.