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AF126 датащи(PDF) 13 Page - 3M Electronics |
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AF126 датащи(HTML) 13 Page - 3M Electronics |
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13 / 15 page ![]() Scotch-WeldTM Structural Adhesive Film AF 126 • AF 126 FR Product Application (continued) Primer Application Priming of bonding surfaces offers two distinct advantages: (1) Priming insures complete wetting of metal surfaces which normally results in superior environmental and low temperature properties and (2) Priming simplifies production by protecting cleaned parts until bonding can be completed. The following system is suggested for spray application. See separate Product Specification Sheet for 3M™ Scotch-Weld™ Structural Adhesive Primer EC-2320 before using. Spray Gun DeVilbiss JGA Air Cap Number 78 Nozzle AV-15-FX Needle FX Line Pressure 35 psi 2.4 bar Cup Pressure 1-2 psi 69-138 millibar Distance from Panel 9 ± 3 inches 23 ± 7.6 cm Primer Thickness (dry) 0.00005-0.0002 inches 1.3-5.1 micron If part design permits, parts may be primed by dipping and draining. Dry Cycle The following dry cycle for Scotch-Weld EC-2320 is suggested for use with 3M™ Scotch-Weld™ Structural Adhesive Films AF 126. Air Dry: Air dry at 75-85°F (24-29.4°C) for a minimum of 30 minutes. Plus Force Dry: Circulating air oven with part at 200°F (93.3°C) for 30 minutes. OR Alternate Dry: Air dry at 75-85°F (24-29°C) for a minimum of 2 hours. Cure Cycle General Cure Requirements Time, temperature and pressure determine the final bond properties. These properties may also be affected by the type of curing equipment used for each specific application. Curing ovens must be vented to the outdoors. In general, the cure properties of Scotch- Weld AF 126 are as follows: Cure Pressure Pressure is required during cure to keep parts in alignment and to overcome distortion and thermal expansion in the adherends. When bonding honeycomb sandwiches utilizing non-perforated core, pressure is required to overcome the thermal expansion of the air contained in each cell of the honeycomb. Honeycomb sections have been bonded successfully with Scotch-Weld AF 126 using perforated or non-perforated core under pressure of 10-25 psi (68.9-172.3 kPa). Cure Temperature The cure temperature may be varied from 180 to 350°F (82-177°C) depending upon the materials being bonded, equipment available and bond properties desired. The film will soften as temperatures are increased and will wet the surface and fillet the core to which it has been applied. A chemical cure will be initiated at 180°F (82°C) and a low strength gel formed. Continued heating chemically converts this gel into a high strength, solvent resistant bond. Cure temperatures in excess of 350°F (177°C) yield usefully, but lower than optimum strengths. - 13 - |
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