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AF3028 датащи(PDF) 2 Page - 3M Electronics |
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AF3028 датащи(HTML) 2 Page - 3M Electronics |
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2 / 6 page ![]() Scotch-WeldTM Structural Core Splice Adhesives AF 3028 • AF 3028 FR - 2 - Product Performance 1. Volatile Content: The volatile content for AF 3028 and AF 3028 FR was determined by measuring the weight loss of a of 4" x 4" square sample of adhesive during cure (3M AdhD Test Method C-286). The polyethylene separating liner was removed prior to cure. Cure time was 1 hour. 250°F (121°C) Cure 350°F (176°C) Cure Volatile content for AF 3028: Less than 1% Less than 1% Volatile content for AF 3028 FR: Less than 1% Less than 1% 2. Cured Density: The free film cured density for AF 3028 and AF 3028 FR was determined by weighing 1" x 1" cured specimens and dividing by the volume of the specimens (3M AdhD Test Method C-2310). Specimens were cured for 1 hour at 250°F (121°C), 4-6°F rise rate/minute. AF 3028 AF 3028 FR Cured Density (Typical) 34 lb/ft3 (.54 g/cc) 29 lb/ft3 (.46 g/cc) 3. Expansion During Cure: The free film expansion ratio for AF 3028 and AF 3028 FR was determined by dividing the average cured thickness of the cured density specimens by the average original (uncured) thickness (3M AdhD Test Method C-286). Cure Cycle: 250°F (121°C), 60 minutes 350°F (176°C), 60 minutes 4-6°F/minute 4-6°F/minute 0 PSIG 0 PSIG AF 3028 AF 3028 FR AF 3028 Expansion Ratio (Typical): 1.8 2.1 1.9 4. Slump or Sag: Sag during cure was measured by laminating a 4" x 4" piece of adhesive to an 8" x 8" x 0.020" clean aluminum panel. It was then placed in a vertical position with the bottom edge horizontal. A scribe line was made along the bottom 4" edge of the adhesive. This assembly was cured as given below and slump or sag is the distance the adhesive flowed beyond the scribe line (3M AdhD Test Method C-277). Cure Cycle: 250°F (121°C), 90 minutes 350°F (176°C), 90 minutes 4-6°F/minute 4-6°F/minute 0 PSIG 0 PSIG AF 3028 AF 3028 FR AF 3028 Sag or Slump (Typical): 0.03" (0.8 mm) 0.02" (0.5 mm) 0.03" (0.8 mm) |
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