6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Single-supply

6

V

Dual-supply

±3

Input voltage, all pins

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Input current, all pins

±10

mA

Output short circuit(2)

Continuous

Continuous

Operating temperature

–55

150

°C

Junction temperature

–55

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

Single-supply

1.7

5.5

Dual-supply

±0.85

±2.75

V

Specified temperature

Specified temperature

–40

+125

°C

6.4 Thermal Information: OPA392

THERMAL METRIC(1)

OPA392

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

187.1

°C/W

Junction-to-case (top) thermal resistance

107.4

°C/W

Junction-to-board thermal resistance

57.5

°C/W

Junction-to-top characterization parameter

33.5

°C/W

Junction-to-board characterization parameter

57.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA392

SBOS926 – JANUARY 2021

www.ti.com

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