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CDC950 датащи(PDF) 5 Page - Texas Instruments

номер детали CDC950
подробное описание детали  133-MHz DIFFERENTIAL CLOCK SYNTHESIZER/DRIVER FOR PC MOTHERBOARDS/SERVERS
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домашняя страница  http://www.ti.com
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CDC950 датащи(HTML) 5 Page - Texas Instruments

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CDC950
133MHz DIFFERENTIAL CLOCK SYNTHESIZER/DRIVER FOR
PC MOTHERBOARDS/SERVERS
SCAS646B − FEBRUARY 2001 − REVISED OCTOBER 2003
5
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Function Tables (Continued)
Table 5. Host/HOST Output Buffer Specifications
INPUT
BOARD TARGET
REFERENCE R,
OUTPUT CURRENT
VOH at Z
MultSel0
MultSel1
BOARD TARGET
TRACE/TERM Z
REFERENCE R,
IREF = VDD/(3 Rr)
OUTPUT CURRENT
IOH
VOH at Z
0
0
60
Ω
Rr = 475 1%,
I_REF = 2.32 mA
5
× IREF
0.71 V at 60
Ω
0
0
50
Ω
Rr = 475 1%,
I_REF = 2.32 mA
5
× IREF
0.59 V at 50
Ω
0
1
60
Ω
Rr = 475 1%,
I_REF = 2.32 mA
6
× IREF
0.85 V at 60
Ω
0
1
50
Ω
Rr = 475 1%,
I_REF = 2.32 mA
6
× IREF
0.71 V at 50
Ω
1
0
60
Ω
Rr = 475 1%,
I_REF = 2.32 mA
4
× IREF
0.56 V at 60
Ω
1
0
50
Ω
Rr = 475 1%,
I_REF = 2.32 mA
4
× IREF
0.47 V at 50
Ω
1
1
60
Ω
Rr = 475 1%,
I_REF = 2.32 mA
7
× IREF
0.99 V at 60
Ω
1
1
50
Ω
Rr = 475 1%,
I_REF = 2.32 mA
7
× IREF
0.82 V at 50
Ω
0
0
30 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
5
× IREF
0.75 V at 30
Ω
0
0
25 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
5
× IREF
0.62 V at 25
Ω
0
1
30 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
6
× IREF
0.90 V at 30
Ω
0
1
25 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
6
× IREF
0.75 V at 25
Ω
1
0
30 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
4
× IREF
0.60 V at 30
Ω
1
0
25 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
4
× IREF
0.5 V at 25
Ω
1
1
30 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
7
× IREF
1.05 V at 30
Ω
1
1
25 (dc equivalent)
Rr = 221 1%,
I_REF = 5 mA
7
× IREF
0.84 V at 25
Ω
NOTE: The entries in boldface are the primary system configurations of interest. The outputs should be optimized for these configurations.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VDD
−0.5 V to 4.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1)
–0.5 V to VDD + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1)
–0.5 V to VDD + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state, IO
2
× rated IOL
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK:(VI < 0)
–50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(VI > VDD)
50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK:(VO < 0)
–50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VO > VDD)
50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 2)
89
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 3)
1070 mW
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA
–0
°C to 85°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for the through-hole packages,
which use a trace length of zero.
3. The maximum package power dissipation is calculated using a junction temperature of 150
°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data
Book, literature number SCBD002.



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