List of figures

Figure 1.

Block diagram (fixed version) .......................................................... 2

Figure 2.

Block diagram (adjustable version) ...................................................... 2

Figure 3.

Pin configuration................................................................... 3

Figure 4.

Typical application diagram (fixed version) ................................................. 4

Figure 5.

Typical application diagram (adjustable version) ............................................. 4

Figure 6.

Output voltage vs. temperature ......................................................... 8

Figure 7.

Output voltage vs. temperature ......................................................... 8

Figure 8.

Output voltage vs. temperature ......................................................... 8

Figure 9.

Output voltage vs. temperature ......................................................... 8

Figure 10.

Line regulation vs. temperature......................................................... 9

Figure 11.

Load regulation vs. temperature ........................................................ 9

Figure 12.

Short-circuit current vs. temp. .......................................................... 9

Figure 13.

Quiescent current vs. temperature....................................................... 9

Figure 14.

Quiescent current vs. temperature....................................................... 9

Figure 15.

Shutdown current vs. temperature....................................................... 9

Figure 16.

Quiescent current vs. load current ...................................................... 10

Figure 17.

Quiescent current vs. load current (magnification) ........................................... 10

Figure 18.

Quiescent current vs. input voltage ..................................................... 10

Figure 19.

Output voltage vs. input voltage ....................................................... 10

Figure 20.

Enable pin current vs. temperature ..................................................... 10

Figure 21.

Dropout voltage vs. temperature ....................................................... 10

Figure 22.

Dropout voltage vs. temperature ....................................................... 11

Figure 23.

Enable threshold vs. temperature ...................................................... 11

Figure 24.

PSRR vs. frequency ............................................................... 11

Figure 25.

Line transient (trise = 5 µs) ........................................................... 11

Figure 26.

Line transient (trise = 1 µs) ........................................................... 11

Figure 27.

Line transient .................................................................... 11

Figure 28.

Load transient ................................................................... 12

Figure 29.

Load transient (trise = 5 µs)........................................................... 12

Figure 30.

Load transient (VOUT = 1.8 V)......................................................... 12

Figure 31.

Load transient (VOUT = VADJ) ......................................................... 12

Figure 32.

Startup transient .................................................................. 12

Figure 33.

Startup transient (trise = 10 µs) ........................................................ 12

Figure 34.

SOT323-5L package outline .......................................................... 15

Figure 35.

SOT323-5L recommended footprint..................................................... 16

Figure 36.

SOT323-5L tape outline............................................................. 17

Figure 37.

SOT323-5L reel outline ............................................................. 18

Figure 38.

Flip-Chip4 package outline ........................................................... 19

Figure 39.

Flip-Chip4 recommended footprint ..................................................... 20

Figure 40.

Flip-Chip4 reel outline .............................................................. 21

Figure 41.

Flip-Chip4 tape outline.............................................................. 22

Figure 42.

DFN6 2x2 package outline ........................................................... 23

Figure 43.

DFN6 2x2 recommended footprint...................................................... 24

Figure 44.

DFN6 2x2 tape outline .............................................................. 25

Figure 45.

Marking composition (flip-chip) ........................................................ 26

STLQ020

List of figures

DS12072 - Rev 3

page 30/31