5th Generation Hi-Speed USB Flash Media and CIR Controller with Integrated Card Power FETs

Datasheet

SMSC USB2231/USB2232

25

Revision 1.3 (07-12-05)

DATASHEET

Chapter 8 Packaging

Figure 8.1 USB2231/USB2232 128-Pin TQFP Package Outline

Notes:

1. Controlling Unit: millimeter.

2. Tolerance on the true position of the leads is ± 0.035 mm maximum.

Package body dimensions D1 and E1 do not include the mold protrusion.

3. Maximum mold protrusion is 0.25 mm.

4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

Table 8.1 USB2231/USB2232 128-Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARKS

A

~

~

1.20

Overall Package Height

A1

0.05

~

0.15

Standoff

A2

0.95

~

1.05

Body Thickness

D

15.80

~

16.20

X Span

D1

13.80

~

14.20

X body Size

E

15.80

~

16.20

Y Span

E1

13.80

~

14.20

Y body Size

H

0.09

~

0.20

Lead Frame Thickness

L

0.45

0.60

0.75

Lead Foot Length

L1

~

1.00

~

Lead Length

e

0.40 Basic

Lead Pitch

Lead Foot Angle

W

0.13

0.18

0.23

Lead Width

R1

0.08

~

~

Lead Shoulder Radius

R2

0.08

~

0.20

Lead Foot Radius

ccc

~

~

0.08

Coplanarity