Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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notch-filter_commercial_avrf_en.fm

EMC Components

AVRF series

Local precautions

Application to board

Mounting head pressure

Under suction nozzle if dead point too, during implementation,

excessive force joins of products low, as cause causes of crack,

please use with reference to something about following.

1) Being set to top surface of substrate so that under suction nozzle

as for dead center, substrate does not bend back, and adjust,

please.

2) Nozzle pressure at implementation is 1 to 3N in static load,

please.

3) Substrate fixes up back surface of substrate with support pin in

impact of suction nozzle to wely deflection to the utmost, and

substrate hold deflection, please. A representative example is

shown in the following.

Mechanical shock that, if positioning your nail to wear, ragged edge

of positionings, participates in products are locally, and products, as

there is possibility of crack generated, cut the closed positioning,

and maintenance and inspection, and, exchange of manage dimen-

sions and position nail periodically, please.

Soldering

Significant impact is possible on the performance of products, flux

checks something about follow, please use.

(1) Flux uses one with 0.1wt % (Cl conversion) or less halide sub-

stance contains amounts, please. In addition, do not do this with

strongly acidic objects.

Flux during is soldered (2) Products is applied the smalleset amount

necessary, please.

(3) If Used soluble flux, perform thorough wash particularly, please.

Reflow temperature profile

Soldering iron

The tip temperature and also by (1) types of soldering irons, the size

of the substrate, and the geometry of the land pattern. Being earlier,

but when as there is possibility that crack occurs in the heat ander-

son impaction, point soldering iron temperature is high, please do

solder work within the following conditions.

Direct iron tip is in contact with the (2) products body, and the strain

owing to thermal shock in particular grows even if a crack is gener-

ated. Therefore, please do not touch it directly to the terminal elec-

trodes.

Cases to avoid

Recommended case

Single-sided

mounting

Double-sided

mounting

Crack

Support pin

Solder peeling

Crack

Support pin

Item

Specification

for eutectic mixture

solder

Use of lead-free

solder

Preheating temperature

160 to 180°C

150 to 180°C

Solder melting temperature

200°C

230°C

Maximum temperature

240°C max

．

260°C max.

Preheating time

100s max.

120s max.

Time to reach higher than the

solder melting temperature

30s max.

40s max.

number of possible reflow cycles 2 max.

2 max.

Temperature

of iron tips

(°C)

Wattage

（W）

Pallet point

shape

(mm)

Soldering time

(Second)

Frequency

350max.

30max.

ø3.0max.

5 max.

Within each

terminal once

(Within total of

twice)

Natural

cooling

t3

t1

Preheating

t2

Soldering

T3

T3

T4

T2

T1

Peak