Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................4

Pin Functions.................................................................... 4

6 Specifications.................................................................. 5

6.1 Absolute Maximum Ratings ....................................... 5

6.2 ESD Ratings .............................................................. 5

6.3 Recommended Operating Conditions ........................5

6.4 Thermal Information ...................................................5

6.5 Electrical Characteristics ............................................6

6.6 Typical Characteristics................................................ 7

7 Detailed Description........................................................9

7.1 Overview..................................................................... 9

7.2 Functional Block Diagram........................................... 9

7.3 Feature Description.....................................................9

7.4 Device Functional Modes..........................................10

8 Application and Implementation.................................. 11

8.1 Application Information..............................................11

8.2 Typical Application.................................................... 11

9 Power Supply Recommendations................................16

10 Layout...........................................................................16

10.1 Layout Guidelines................................................... 16

10.2 Layout Example...................................................... 16

11 Device and Documentation Support..........................17

11.1 Receiving Notification of Documentation Updates.. 17

11.2 Support Resources................................................. 17

11.3 Trademarks............................................................. 17

11.4 Electrostatic Discharge Caution.............................. 17

11.5 Glossary.................................................................. 17

12 Mechanical, Packaging, and Orderable

Information.................................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (June 2020) to Revision C (September 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added AEC-Q100 Temperature Grade 0 rating for SOT-5X3/DYA package...................................................... 1

• Moved HBM and CDM ESD classification levels to ESD Ratings table............................................................. 1

• Removed DYA preview notice............................................................................................................................ 1

• Updated Device Comparison table with 150 °C rating for DYA packages..........................................................3

• Increased maximum junction temperature from 150 to 155 in Absolute Maximum Ratings Table..................... 5

• Increased maximum storage temperature from 150 to 155 in Absolute Maximum Ratings Table......................5

• Added DYA package to Thermal Information table.............................................................................................5

• Added 1000 hour Long Term Drift specification for DYA package......................................................................6

• Changed the Typical Characteristics section......................................................................................................7

• Added Built-In Fail Safe section........................................................................................................................10

Changes from Revision A (March 2020) to Revision B (June 2020)

Page

• Added DYA package as preview information......................................................................................................1

• Updated Device Comparison table..................................................................................................................... 3

• Corrected view description in Pin Configuration and Functions......................................................................... 4

• Changed Maximum ISNS from 400 µA to 40 µA in Recommended Operating Conditions Table ..................... 5

Changes from Revision * (December 2019) to Revision A (March 2020)

Page

• Updated Title.......................................................................................................................................................1

• Changed device status from Advanced Information to Production Data............................................................ 1

• Updated features list...........................................................................................................................................1

• Updated Applications..........................................................................................................................................1

• Updated Description........................................................................................................................................... 1

• Updated Thermistor Design Tool link................................................................................................................10

TMP63-Q1

SNIS215C – JANUARY 2020 – REVISED SEPTEMBER 2020

www.ti.com

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