LP5907 datasheet(6/47 Pages) TI

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LP5907

SNVS798O – APRIL 2012 – REVISED JUNE 2020

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Product Folder Links: LP5907

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LP5907

UNIT

DBV

(SOT-23)

DQN

(X2SON)

YKE

(DSBGA)

YKG

(DSBGA)

YKM

(DSBGA)

5 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

193.4

216.1

206.1

191.6

194.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

102.1

161.7

1.5

2.4

3.0

°C/W

RθJB

Junction-to-board thermal resistance

45.8

162.1

37.0

58.9

62.7

°C/W

ψJT

Junction-to-top characterization parameter

8.4

5.1

15.0

1.1

°C/W

ψJB

Junction-to-board characterization parameter

45.3

161.7

36.8

58.9

62.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

123.0

n/a

°C/W

(1)

All voltages are with respect to the device GND terminal, unless otherwise stated.

(2)

Minimum and maximum limits are ensured through test, design, or statistical correlation over the junction temperature (TJ) range of

–40°C to 125°C, unless otherwise stated. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for

reference purposes only.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Application and

Implementation.

(4)

The device maintains a stable, regulated output voltage without a load current.

(5)

Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT.

(6)

Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.

(7)

Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its

nominal value.

(8)

Short-circuit current (ISC) for the LP5907 is equivalent to current limit. To minimize thermal effects during testing, ISC is measured with

VOUT pulled to 100 mV below its nominal voltage.

6.5 Electrical Characteristics

VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA, CIN = 1 µF, COUT = 1 µF (unless otherwise noted)

(1) (2) (3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN

Input voltage

TA = 25°C

2.2

5.5

ΔVOUT

Output voltage tolerance

VIN = (VOUT(NOM) + 1 V) to 5.5 V,

IOUT = 1 mA to 250 mA

–2

%VOUT

VIN = (VOUT(NOM) + 1 V) to 5.5 V,

IOUT = 1 mA to 250 mA

(VOUT < 1.8 V, SOT-23, X2SON packages)

–3

Line regulation

VIN = (VOUT(NOM) + 1 V) to 5.5 V,

IOUT = 1 mA

0.02

%/V

Load regulation

IOUT = 1 mA to 250 mA

0.001

%/mA

ILOAD

Load current

See(4)

250

Maximum output current

250

Quiescent current(5)

VEN = 1.2 V, IOUT = 0 mA

µA

VEN = 1.2 V, IOUT = 250 mA

250

425

VEN = 0.3 V (disabled)

0.2

Ground current(6)

VEN = 1.2 V, IOUT = 0 mA

µA

VDO

Dropout voltage(7)

IOUT = 100 mA

IOUT = 250 mA (DSBGA package)

120

200

IOUT = 250 mA (SOT-23, X2SON packages)

250

ISC

Short-circuit current limit

TA = 25°C

(8)

250

500

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