Contents

1

Pin description ....................................................................2

2

Acoustic and electrical specifications ..............................................3

2.1

Acoustic and electrical characteristics ............................................. 3

2.2

Timing characteristics ........................................................... 4

2.3

Frequency response ............................................................ 5

3

Application recommendations .....................................................6

4

Carrier tape mechanical specifications .............................................7

5

Process recommendations ........................................................8

6

Sensing element..................................................................10

7

Absolute maximum ratings .......................................................11

8

Functionality .....................................................................12

8.1

L/R channel selection .......................................................... 12

9

Package information..............................................................13

9.1

Soldering information .......................................................... 13

9.2

HCLGA package information .................................................... 13

Revision history .......................................................................16

IMP34DT05

Contents

DS12725 - Rev 3

page 17/20