Contents

1

Description ........................................................................3

2

Data brief scope ...................................................................4

2.1

ST33TPHF2ESPI products ...................................................... 4

2.2

Firmware image................................................................ 4

3

Pin and signal description .........................................................5

4

Integration guidance...............................................................7

4.1

Typical hardware implementation ................................................. 7

4.2

Power supply filtering ........................................................... 8

5

Package information...............................................................9

5.1

28-pin thin shrink small outline package information ................................. 9

5.2

32-lead very thin fine pitch quad flat pack no-lead (VFQFPN) package information....... 10

5.3

Thermal characteristics of packages ............................................. 13

6

Delivery packing..................................................................14

7

Package marking information .....................................................17

8

Ordering information .............................................................18

9

Firmware image overview.........................................................19

10

Support and information ..........................................................20

Appendix A Terms and abbreviations .................................................21

Revision history .......................................................................22

Contents ..............................................................................23

List of tables ..........................................................................24

List of figures..........................................................................25

ST33TPHF2ESPI

Contents

DB2716 - Rev 4

page 23/26