TMUX13 datasheet(6/42 Pages) TI

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Pin Functions TMUX1309

TYPE(1)

DESCRIPTION(1)

NAME

NO.

S0B

I/O

Source pin 0 of mux B. Can be an input or output.

S2B

I/O

Source pin 2 of mux B. Can be an input or output.

I/O

Drain pin (Common) of mux B. Can be an input or output.

S3B

I/O

Source pin 3 of mux B. Can be an input or output.

S1B

I/O

Source pin 1 of mux B. Can be an input or output.

Active low logic input. When this pin is high, all switches are turned off. When this pin is low, the A[1:0]

address inputs determine which switch is turned on.

N.C.

Not Connected

Not Connected.

GND

Ground (0 V) reference

Address line 1. Controls the switch configuration as shown in Table 8-2.

Address line 0. Controls the switch configuration as shown in Table 8-2.

S3A

I/O

Source pin 3 of mux A. Can be an input or output.

S0A

I/O

Source pin 0 of mux A. Can be an input or output.

I/O

Drain pin (Common) of mux A. Can be an input or output.

S1A

I/O

Source pin 1 of mux A. Can be an input or output.

S2A

I/O

Source pin 3 of mux A. Can be an input or output.

VDD

Positive power supply. This pin is the most positive power-supply potential. For reliable operation,

connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.

Thermal pad

—

Not Connected

Exposed thermal pad. No requirement to solder this pad, if connected it should be left floating or tied to

GND.

(1)

Refer to Section 8.3.6 for what to do with unused pins.

TMUX1308, TMUX1309

SCDS426C – MARCH 2020 – REVISED AUGUST 2020

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