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SAMA5D27 датащи(PDF) 49 Page - Microchip Technology

номер детали SAMA5D27
подробное описание детали  SAMA5D27 MPU, 1Gbit (128MB) DDR2 SDRAM, 10/100 Ethernet PHY, 64Mbit (8MB) Flash, Power Management IC, 1Kbit EEPROM
PDF  55 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SAMA5D27 датащи(HTML) 49 Page - Microchip Technology

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The SAMA5D27 SOM1 can be soldered to the host PCB by using the standard and lead-free solder reflow profile. To
avoid damage to the module, follow the JEDEC recommendations as well as those listed below:
• Do not exceed the peak temperature (Tp) of 245ºC.
• Refer to the solder paste data sheet for specific reflow profile recommendations.
• Use no-clean flux solder paste.
• Use only one flow. If the PCB requires multiple flows, mount the module at the time of the final flow.
Figure 11-1. Reflow Profile Example used for Soldering SAMA5D27 SOM1 Module on SAMA5D27-SOM1-EK1
Board
IPC-020e-5-1
Tc -5°C
t
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Preheat Area
Tsmax
Tsmin
ts
Tp
TL
Time
25
Time 25°C to Peak
Supplier Tp > Tc
-
Supplier tp
Tc
User Tp < Tc
-
User tp
Tc -5°C
tp
L
Profile Feature
J-STD-020E Profile
Temperature Min
Tsmin
150°C
Temperature Max
Tsmax
200°C
Temperature Rise
ts (from Tsmin to Tsmax)
60 to 120 seconds
Ramp-up Rate
TL to Tp
3°C/sec.max
Liquidous Temperature Time maintained above 217°C
TL
60 to 150 seconds
Peak Temperature
Tp
245°C
Time (tp) within 5°C of the specified classification temperature (Tc)
30 seconds
Ramp-down rate
Tp to TL
6°C/second max
Time 25°C to peak temperature
8 minutes max
SAMA5D27 SOM1
Production Settings
© 2020 Microchip Technology Inc.
Datasheet
DS60001521D-page 49



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