7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply Voltage

–0.3

22

V

Analog Inputs,

–30

30

V

Common - mode

–20

122

V

Output

GND – 0.3

Vs + 0.3

V

Operating Temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

VIN+ and VIN– are the voltages at the VIN+ and VIN– pins, respectively.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

±1000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input range(1)

48

120

V

Operating supply range

2.7

5

20

V

Ambient temperature

–40

125

°C

(1)

7.4 Thermal Information

THERMAL METRIC(1)

INA2290

INA290

UNIT

DGK (VSSOP)

DCK (SC-70)

8 PINS

5 PINS

Junction-to-ambient thermal resistance

169.3

191.6

°C/W

Junction-to-case (top) thermal resistance

60.1

144.4

°C/W

Junction-to-board thermal resistance

91.3

69.2

°C/W

Junction-to-top characterization parameter

8.3

46.2

°C/W

Junction-to-board characterization parameter

89.7

69.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA290, INA2290

SBOS961A – JUNE 2020 – REVISED SEPTEMBER 2020

www.ti.com

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