6 Specifications

6.1 Absolute Maximum Ratings

see (1)

MIN

MAX

UNIT

Power-supply voltage

VDD to GND

–0.3

6.5

V

Analog input voltage

INP, INN

HGND – 6

V

Analog output voltage

OUTP, OUTN

GND – 0.5

VDD + 0.5

V

Digital output voltage

DIAG

GND – 0.5

5.5

V

Input current

Continuous, any pin except power-supply pins

–10

10

mA

Temperature

150

°C

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±2000

V

Charged device model (CDM), per JESD22-C101 (2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

POWER SUPPLY

VDD

Low-side power supply

VDD to GND

3

3.3

5.5

V

ANALOG INPUT

Differential input voltage before clipping output

±64

mV

Specified linear differential full-scale voltage

–50

50

mV

Absolute common-mode input voltage (1)

–2

V

Operating common-mode input voltage

–0.032

1

V

TEMPERATURE RANGE

Specified ambient temperature

–40

125

°C

(1)

operation. Observe analog input voltage range as specified in Section 6.1.

6.4 Thermal Information

THERMAL METRIC(1)

AMC3302

UNIT

DWE (SOIC)

16 PINS

Junction-to-ambient thermal resistance

73.5

°C/W

31

°C/W

Junction-to-board thermal resistance

44

°C/W

Junction-to-top characterization parameter

16.7

°C/W

Junction-to-board characterization parameter

42.8

°C/W

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

AMC3302

SBASA11 – AUGUST 2020

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