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ASM2I9940L датащи(PDF) 9 Page - Alliance Semiconductor Corporation

номер детали ASM2I9940L
подробное описание детали  Low Voltage 1:18 Clock Distribution Chip
PDF  13 Pages
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производитель  ALSC [Alliance Semiconductor Corporation]
домашняя страница  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

ASM2I9940L датащи(HTML) 9 Page - Alliance Semiconductor Corporation

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June 2005
ASM2I9940L
rev 1.0
Low Voltage 1:18 Clock Distribution Chip
9 of 13
Notice: The information in this document is subject to change without notice.
TJ,MAX should be selected according to the MTBF
system requirements and Table 11. Rthja can be derived
from Table 12. The Rthja represent data based on 1S2P
boards, using 2S2P boards will result in a lower thermal
impedance than indicated below.
Table 12. Thermal package impedance of the
32LQFP
Convection,
LFPM
Rthja (1P2S
board), °C/W
Rthja (2P2S
board), °C/W
Still air
86
61
100 lfpm
76
56
200 lfpm
71
54
300 lfpm
68
53
400 lfpm
66
52
500 lfpm
60
49
If the calculated maximum frequency is below 250MHz, it
becomes the upper clock speed limit for the given
application conditions. The following eight derating charts
describe the safe frequency operation range for the
ASM2I9940L. The charts were calculated for a maximum
tolerable die junction temperature of 110
°C (120°C),
corresponding to an estimated MTBF of 9.1 years
(4 years), a supply voltage of 3.3V and series terminated
transmission line or capacitive loading. Depending on a
given set of these operating conditions and the available
device convection a decision on the maximum operating
frequency can be made.



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