18

Am7953X Data Sheet

PHYSICAL DIMENSION

PL032

REVISION SUMMARY

Revision B to Revision C

•

Minor changes to the data sheet style and format were made to conform to AMD standards.

•

Connection Diagrams—Changed pin 29 from TP to RSVD in the Am79534 diagram.

Revision C to Revision D

•

In Table 1, SLIC Decoding, the Open Circuit state of 001 was changed to 000.

•

In Pin Description table, inserted/changed TP pin description to: “Thermal pin. Connection for heat dissipation.

Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP

pins can connect to an area of copper on the board to enhance heat dissipation.”

•

Minor changes to the data sheet style and format were made to conform to AMD standards.

Revision D to Revision E

•

The physical dimension (PL032) was added to the Physical Dimension section.

•

Deleted the Ceramic DIP and Plastic DIP parts (Am79530 and Am79531) and references to them.

•

Updated Pin Desciption to correct inconsistencies.

.050 REF.

.026

.032

TOP VIEW

Pin 1 I.D.

.485

.495

.447

.453

.585

.595

.547

.553

16-038FPO-5

PL 032

DA79

6-28-94 ae

SIDE VIEW

SEATING

PLANE

.125

.140

.009

.015

.080

.095

.042

.056

.013

.021

.400

REF.

.490

.530