7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

IN

13

V

EN

–0.3

IN + 0.3

Output voltage

–0.3

5.5

V

Output short circuit current

20

mA

Temperature

–55

150

°C

–65

170

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2500

V

Charged-device model (CDM), per AEC Q100-011

±1500

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

IN

12

V

EN

Enable voltage

0

IN

V

Output current

–10

10

mA

Operating temperature

–40

25

125

°C

(1)

Dropout voltage

7.4 Thermal Information

THERMAL METRIC(1)

REF34-Q1

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

122.6

°C/W

Junction-to-case (top) thermal resistance

80.2

°C/W

Junction-to-board thermal resistance

42

°C/W

Junction-to-top characterization parameter

23.2

°C/W

Junction-to-board characterization parameter

41.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

REF34-Q1

SBAS901B – JULY 2018 – REVISED SEPTEMBER 2020

www.ti.com

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