Standoff 55V 500mA 850KHz Sync Step-Down Regulator

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Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

Thermal Information

Item

Description

Value

Unit

105

°C/W

Junction-to-case (top) thermal resistance

55

°C/W

Junction-to-board thermal resistance

17.5

°C/W

Junction-to-top characterization parameter

3.5

°C/W

Junction-to-board characterization parameter

17.5

°C/W

Note (1): The package thermal impedance is calculated in accordance to JESD 51-7.

Note (2): Thermal Resistances were simulated on a 4-layer, JEDEC board.

Parameter

Test Conditions

Min

Typ.

Max

Unit

Input Voltage Range

4.5

45

V

Supply Current (Quiescent)

0.4

0.8

mA

Supply Current (Shutdown)

10

uA

Feedback Voltage

0.780

0.800

0.820

V

0.746

0.765

0.784

V

0.585

0.600

0.615

V

High-Side Switch On-Resistance

500

mΩ

Low-Side Switch On-Resistance

300

mΩ

Valley Switch Current Limit

1

A

Over Voltage Protection Threshold

48

V

Switching Frequency

850

KHz

Maximum Duty Cycle

VFB=90%

89

%

Minimum On-Time

83

nS

EN Rising Threshold

1.2

V

EN Falling Threshold

0.9

V

Under-Voltage Lockout Threshold

4.2

4.4

V

3.4

3.7

V

500

mV

Soft Start

1

mS

Thermal Shutdown

150

℃

Thermal Hysteresis

30

℃

Note (1): MOSFET on-resistance specifications are guaranteed by correlation to wafer level measurements.

Note (2): Thermal shutdown specifications are guaranteed by correlation to the design and characteristics analysis.

HM8119A

HM8119B

HM8119C

HM8119