 2014 Microchip Technology Inc.

DS20005284A-page 29

MCP2561/2FD

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact the factory or one of the sales offices listed on the back page

.

PART NO.

-X

/XX

Package

Temperature

Range

Device

Device:

MCP2561FD:High-Speed CAN Transceiver with SPLIT

MCP2561FDT:High-Speed CAN Transceiver with SPLIT



(Tape and Reel) (DFN and SOIC only)



(Tape and Reel) (DFN and SOIC only)

Temperature

Range:

E

=

-40°C to +125°C (Extended)

H

=

-40°C to +150°C (High)

Package:

MF = Plastic Dual Flat, No Lead Package -

3x3x0.9 mm Body, 8-lead

P

= Plastic Dual In-Line - 300 mil Body, 8-lead

SN = Plastic Small Outline - Narrow, 3.90 mm Body,



8-lead

Examples:

a)

MCP2561FD-E/MF:Extended Temperature,



8LD 3x3 DFN package.

b)

MCP2561FDT-E/MF:Tape and Reel,



Extended Temperature,



8LD 3x3 DFN package.

c)

MCP2561FD-E/P: Extended Temperature,



8LD PDIP package.

d)

MCP2561FD-E/SN:Extended Temperature,



8LD SOIC package.

e)

MCP2561FDT-E/SN:Tape and Reel,



Extended Temperature,



8LD SOIC package.

a)

MCP2561FD-H/MF:High Temperature,



8LD 3x3 DFN package.

b)

MCP2561FDT-H/MF:Tape and Reel,



High Temperature,



8LD 3x3 DFN package.

c)

MCP2561FD-H/P: High Temperature,



8LD PDIP package.

d)

MCP2561FD-H/SN:High Temperature,



8LD SOIC package.

e)

MCP2561FDT-H/SN:Tape and Reel,



High Temperature,



8LD SOIC package.